We have light boron-doping monocrystalline silicon ingot and light phosphorus-doping monocrystalline silicon ingot. Once the ingot is fully-grown, it is ground to a rough size diameter a little larger than the desired diameter of the finished silicon wafer. The ingot is then given a notch or flat to indicate its orientation, depending on the wafer diameter, customer specifications, or SEMI Standards. Once it has passed a number of inspections, the ingot is sliced into wafers.